New Advanced Design Pumps For Building Operations

Expanding on the company's Design Envelope technology, this new line of pumps features 33 energy savings models.


https://facilityexecutive.com/2015/12/new-product-flash-generation-3-de-pumps-from-armstrong-fluid-technology/
Expanding on the company's Design Envelope technology, this new line of pumps features 33 energy savings models.
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New Product Flash: Generation 3 DE Pumps From Armstrong Fluid Technology

New Advanced Design Pumps For Building Operations

Armstrong Fluid Technology recently introduced its Generation Three Design Envelope pumps featuring 33 advanced energy savings models ranging in sizes from one to 75HP. Expanding on its Design Envelope (DE) technology, Armstrong designed the new pumps to increase further building owners’ energy savings while providing more sustainable solutions.fluid flow

“The Design Envelope technology integrates the latest selection, control, and hydronic tools into heat-transfer solutions that naturally accommodate changes in building design and demand to ensure that system performance is at an optimum at any given time,” according to Lex van der Weerd, CEO of Armstrong. “It is a more intelligent method of ensuring better HVAC equipment efficiency and achieving the lowest lifecycle cost.”

fluid flow
Generation Three Design Envelope Pump from Armstrong Fluid Technology

The new Generation 3 Design Envelope pumps feature:

  • TEFC Motors as standard to 25HP
  • 230/460/575V options
  • Fixed configuration codes for ease of product identification and order entry
  • “Flat Map” selection
  • Two to 10 day express shipment
  • Exceeds ASHRAE 90.1 energy standard for buildings

As with all Armstrong Design Envelope Pumps with integrated controllers, these new models are pre-approved by OSHPD (CA Office of Statewide Health and Planning Development) for use in seismic activity regions. Regarding installation, Design Envelope pumps are generally installed without the use of large concrete inertia bases and housekeeping pads.

Armstrong’s Design Envelope technology is built around four core competencies: heat transfer, fluid flow, variable speed, and demand based control. The technology delivers optimized lifetime building performance by modeling equipment and system behavior, monitoring authentic system conditions, and dynamically adjusting equipment operation to match system demand. This is achieved through specific Armstrong product combinations that make up a suite of solutions. Those products are pumping systems, booster systems, an Intelligent Fluid Management System (iFMS), an Integrated Plant Controller (IPC), a Chilled Water Integrated Plant Package (IPP), and Compass circulators.

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